Resume

18 years bridging semiconductor R&D and high-volume manufacturing.

Professional Summary

18 years bridging semiconductor R&D and high-volume manufacturing. I help semiconductor companies bridge the gap between R&D and high-volume manufacturing by leading complex technology transfers, factory expansions, and global manufacturing operations. With 18 years of experience, I enjoy solving complex manufacturing challenges, leading cross-functional projects, and delivering on schedule with the quality and reliability the business demands.

18yrsExperience
$300M+Transfer Led
$28MCost Savings
80%Cycle Reduction
300+Tools Relocated

Experience

Senior Staff Product Integration Engineer & Research Scientist — Wolfspeed
2017 – 2026
  • Led technology transfers across USA, China, and Malaysia, including a $300M+ transfer from USA to Malaysia.
  • Directed a $7M technology transfer, $58M facility relocation, and $170M capacity expansion.
  • Drove CMP yield improvement, AI-based optical inspection, and production automation — cutting cycle time 80% and saving $2.8M.
  • Managed the relocation of 300+ production tools and directed datacenter operations.
$2.8M saved 80% faster cycle time 300+ tools relocated
Senior Technology & Integration Engineer — GLOBALFOUNDRIES
2011 – 2017
  • Integration lead for 32nm, 28nm, and 14nm technology nodes.
  • Led NPI, HVM ramp, BEOL integration, and technology transfers, driving $28M in savings and a 40% capacity boost.
  • Delivered a 4% edge yield improvement, 14% throughput improvement, and 10% cycle time reduction, plus $0.7M in quarterly savings.
  • Partnered directly with IBM, Samsung, Qualcomm, Microsoft, and Broadcom.
$28M saved 40% capacity boost 14% throughput up

Innovations

HoloLens Remote Training
Mixed-reality platform for remote tool qualification and operator training.
Smart CMP Monitoring
Real-time monitoring system driving measurable CMP yield gains.
Production Layout Optimization
Re-engineered factory layout to raise throughput and reduce cycle time.

Skills

Leadership
  • Semiconductor HVM Operations.
  • Capital & ROI Analysis.
  • Planning & Capacity Management.
  • Foundry Supplier & Stakeholders Management.
  • Excellent Communication Skills.
  • Creative & Pro-active Thinker.
  • Structured Problem-solving.
  • Effective Communicator & Team LeaderProgram Leadership
Technical
  • Production & Technology Transfer.
  • Product & Process Integration.
  • NPI & Process Development.
  • AIAG-8D, Six Sigma Green Belt.
  • Systems: Production KPIs, APC, SPC, MES, SEC/GEMs, QMS (Quality Management System).
  • Analytical: JMP, ACE, SQL, Spotfire, Tableau, Power BI & Python.

Education

Ph.D. in Electrical Engineering
Thesis: Fabrication of Novel Germanium Oxide Cladded Germanium Quantum Dots and Quantum Dot Gate Nonvolatile Memory using GeOx-Ge QDs
University of Connecticut
Research Grants: NIH, ONR, NSF, NSF-RUE, DARPA

M.S.in Electrical Engineering
University of Connecticut
Research Grants: NIH, DARPA

Honors

2013-2015 Global Recognition Award 2016 Spotlight Award 2017 GLOBY Award Nominee 2022 Special Recognition Award 2024 Executive Recognition Award 2024 Special Recognition Datacenter Support 2025 Going Above & Beyond Award 2025 Special Recognition Facilities Support